SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- Written by PR Newswire
- To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D
- Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue.
- Industry's first investment in advanced packaging for AI products on American soil, strengthens...
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