Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding
- Written by PR Newswire
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SAN LUIS OBISPO, Calif., Jan. 16, 2024 /PRNewswire/ -- Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.
The...















