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Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding

  • Written by PR Newswire
Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding

SAN LUIS OBISPO, Calif., Jan. 16, 2024 /PRNewswire/ -- Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.

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Hard Chrome Plating: Enhancing Durability And Performance In Industrial Components

In industries where equipment is exposed to constant friction, pressure, and harsh operating conditions, surface protection becomes critical to performance and longevity. Hard chrome plating is a specialised surface treatment process widely used to improve wear resistance, reduce friction, and extend... Read more

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