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Toray Engineering: Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels

  • Written by Media Outreach

High-accuracy packaging in panel level packaging

TOKYO, JAPAN - Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP". PLP is an advanced semiconductor packaging technology, for which there is growing demand...

Read more: Toray Engineering: Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass...

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