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The Times

TRUMPF makes glass substrates ready for the next generation of AI chips

  • Written by Media Outreach

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.

DITZINGEN, GERMANY / TAIPEI, TAIWAN - Media OutReach Newswire -...

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