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Lendela secures US$5M in oversubscribed Series A round to bring more transparency to Asia-Pacific’s lending industry

  • Written by Media Outreach
SINGAPORE - Media OutReach - 23 November 2023 - Lendela, the digital loan matchmaking platform, announced today its successful $US5M Series A funding round. The oversubscribed round was led by Singapore-based Chocolate Ventures, with participation from Lendela’s seed investor Cocoon Capital. The round was also joined by Phillip...

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